Sine-Feed Micro-Peck Option – Lubbering L.ADU Sine-Feed

Sine-Feed Micro-Peck Option – Lubbering L.ADU Sine-Feed

The Sine-Feed micro-peck solution combines periodic low-frequency axial spindle vibration with constant spindle advance to break long chips into micro chips and improve chip removal.

It is suitable even for piloted holes, helps vacuum away chips and dust, and reduces the risk of material damage – for example in a clean CFRP-to-titanium transition.

Key Features

• Chip evacuation: The process helps break long chips into micro chips so they can be vacuumed easily, supporting outstanding chip removal.
• Surface quality: At the countersink point, the Sine-Feed is uncoupled, helping provide a clean surface.
• Dry cutting: The solution is durable, generates low heat, and allows dry cutting without MQL.
• System integration: This L.ADU option integrates into the modular L.ADU system in pneumatic and electronic versions.

Technical Data

Frequently Asked Questions

What is the Sine-Feed option for?
It is designed to improve chip removal by breaking long chips into micro chips while maintaining a stable drilling process.

Can it be used in piloted holes?
Yes, it works even on piloted holes.

Is MQL required?
No. Dry cutting is possible without MQL.